製品情報 Products

Bonding wire

Micro size wire technologies and alloying technologies deliver all the type of bonding wires, Au wire, Ag wire and Cu wire.
Customizable upon applications.
  • * Certified ISO9001:JQA-0680/ISO14001:JQA-EM0606
  • * We produce our bonding wires only after confirming with material suppliers that the supplied materials do not contain any conflict minerals—tantalum [Ta], tungsten [W], tin [Sn], and gold [Au], which are sources of funding for armed groups in the Democratic Republic of the Congo and surrounding areas.

Cu wire

  • Cost saving alternative of Au wire
    20 years of challenge of Cu wire technologies for the applications of greater sophistication and complication and the global market.
    Well prevailed cost saving material globally with gold price rising of recent years as a background.
    Widely adopted by discrete package to IC package with high number wires.

 

Ag wire

  • Bonding wire of Ag unique characteristics
    Rapidly adapted by IC and LED market latest years.
    Especially our Ag wire contributes to increase LED luminance and has great reputation among LED industry.

 

Pd-Cu wire

  • New wire with characteristics of both Au and Cu wires
    Palladium plated copper wire delivers the lower cost than Au wire and greater in manufacturing control than bare copper wire.
    However manufacturing cost is slightly high and industry expects technological breakthrough.

 

Au wire

  • Super thin wire technology fights against gold price rising.
    Quick response of sales, manufacturing in teamwork, and pinpoint precision engineering service are well recognized by Japan domestic market and our Au wire is widely used in electronic devices made in Japan.

 

Au Bumping wire

  • Great solution for flip-chip applications
    Born from Au wire technologies of long history.
    Au bumping wire delivers stable bump formation in flip chip applications.