製品情報 Products
  • Developed by technologies with long history and experiences of wire manufacture
    Integrated manufacturing of casting, wire drawing, annealing, and rewinding and tight quality control delivers the best Au wire to the market.

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High-Loop Type
TG-S Series

  • Easily forms a high loop and is least likely to be short-circuited at the edge of a chip.
  • Resistant to damage at the neck region, disconnection, and breakdown caused by vibration.
  • Soft wires make possible an attractive loop.
  • Suitable for the thick wires of power ICs.

 

Medium-height loop Type
TG-U Series

  • Provides a high loop while maintaining high strength and excellent resistance to wire sweep.
  • Resistant to damage at the neck region, disconnection and breakdown caused by vibration.
  • Versatile gold bonding wire accommodates a wide variety of applications requiring a large or small number of pins.

 

Low-Loop Type
TG-X Series

  • The stable formation and high-strength of low loops exhibit superior resistance to wire sweep.
  • High heat resistance ensures excellent temperature cycling characteristics.
  • Suitable for TSOP, TQFP, and other slimline packages subject to thickness restrictions.
  • Suitable for QFN, QFP, and other packages with large numbers of pins and long loop bonding.

 

Long-Loop Type
TG-V Series

  • The stable formation and high strength of low loops ensure excellent resistance to wire sweep.
  • High heat resistance ensures excellent temperature cycling characteristics.
  • Suitable for TSOP, TQFP, and other slimline packages subject to thickness restrictions.
  • Suitable for QFN, QFP, and other packages with large numbers of pins and long loop bonding.

 

Ultra-Low and Long-Loop Types
TG-L Series

  • The stable formation and high strength of the ultra-low loops ensure excellent resistance to wire sweep.
  • High heat resistance ensures excellent temperature cycling characteristics.
  • Small crystals at the ball neck region provide extremely high resistance to damage at the neck region.
  • The stable circularity of the squashed ball shape is suitable for fine pitch bonding.
  • Suitable for slimline packages such as BGA and stacked CSP with large numbers of pins.
  • TG-L1
    Ball Formation
    Short Loop
  • TG-L2
    Long Loop

 

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