In the electronics field, we propose environmentally friendly manufacturing methods utilizing our strengths in polymer compounding and fine particle dispersion technologies. TATSUTA supports the evolution of electronics and contributes to reducing the environmental impact of its customers’ manufacturing processes.

Based on the EU WEEE and RoHS Directives, lead-free packaging has become a common practice. While leaded solder was replaced by alternative lead-free solder, technological innovations are creating demands for finer-pitch packaging, low-temperature packaging and heat-resistant packaging. High expectations are placed on conductive adhesive technology as an environmentally friendly technology to enable lead-free, low-temperature processing using no flux. In manufacturing electronic circuits and devices in printed electronics, vacuum processes such as sputtering and wet processes such as etching and plating have been commonly used. However, the use of plating, for example, has a high environmental impact including CO₂ emissions from consuming a large amount of electricity, chemicals, and a large volume of water. Thus, replacing these wet methods with “dry printing methods” is expected to further improve productivity while saving energy and resources.