Gold Wire | Bonding wires | Electronic materials | Products & Services

Bonding wires and bumping wires Gold wire

High-performance fine wires developed by exploiting ultrafine wire technology We have produced gold wires for semiconductors for over 30 years since our foundation. We have developed an integrated production system under strict quality control. Using high-purity pure gold, we incorporate various improvements and development technologies during such processes as casting, drawing, tempering, and rewinding.
With our quick response and detailed technical support through cooperation between production and sales, our products are well accepted by major semiconductor manufacturers and installed in many electronic components.

Product details

Product lineup

High Loop Type TG-S Series
- High loops easily formed, restricting short circuits at a chip edge.
- Highly resistant to neck damage and wire breakage caused by vibration.
- Softness of wire allows for a cleanly shaped loop.
- Suitable for power ICs with thick wires.
Medium Height Loop Type TG-U Series
- Although very strong, the wire is also able to provide a high loop with excellent resistance to wire sweep.
- Highly resistant to neck damage and wire breakage caused by vibration.
- This versatile gold bonding wire can be used in a wide range of packaging applications from low to high pin count.
Low Loop Type TG-X Series
- The stability and high strength of the low loop provide high resistance to wire sweep.
- High heat resistance ensures excellent temperature cycling characteristics.
- Suitable for TSOP, TQFP, and other slimline packaging subject to thickness restrictions.
- Suitable for QFN, QFP, and other packaging with high pin counts and long loop bonding.
Long Loop Type TG-V Series
- The stability and high strength of the low loop provide high resistance to wire sweep.
- High heat resistance ensures excellent temperature cycling characteristics.
- Suitable for TSOP, TQFP, and other slimline packaging subject to thickness restrictions.
- Suitable for QFN, QFP, and other packaging with high pin counts and long loop bonding.
Ultra-low / Long Loop Types TG-L Series
- The stable formation and high strength of the ultra-low loops ensure excellent resistance to wire sweep.
- High heat resistance ensures excellent temperature cycling characteristics.
- Smaller crystals at the ball neck region provide extremely high resistance to neck damage.
- The stable roundness of the ball bond makes it suitable for fine pitch bonding.
- Suitable for slimline packaging such as BGAs and stacked CSPs with high pin counts.
Relationship between breaking load and loop height(25µm)

TG-L1

Ball formation

Short loop

TG-L2

Long loop