Bonding wires Copper wire
Cost saving alternative to gold wire. For about 30 years, we have been striving to improve our copper wire technology to meet ever-complicating and -sophisticating applications and overseas demands. Due to the sharp rise in gold prices in recent years, the sales of cost-effective copper wires have taken off mainly overseas. Adoption is expanding from discrete small-pin systems to multi-pin IC applications.
Product details
Product lineup
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Highly Pure Copper Type TC-A
- Lower cost compared to gold wire.
- Superior long-term reliability compared to gold wire, making it suitable for automotive IC applications.
- Better conductivity than gold wire, making it ideal for higher speeds in LSIs and as a remedy for heat radiation.
- Due to the use of highly pure (6N) copper with few contaminants, the initial ball is soft and it is more resistant to chip damage.
- Excellent second and subsequent bonding results from oxygen-free (4N) copper material.
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4N Copper Type TC-E・TC-ER
- Lower cost compared to highly pure copper (6N) with excellent cost performance
- Compared to highly pure copper (6N), this material is stronger, with superior roundness properties of the ball bond.
- Superior long-term reliability compared to gold wire, making it suitable for automotive IC applications.
- Better conductivity than gold wire, making it ideal for higher speeds in LSIs and as a remedy for heat radiation.
- More stability in FAB forming due to minute amounts of additives (TC-ER)
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Copper Alloy Type MCXE (for fine pitch applications)
- Enables stable FAB forming because of its single melting point structure.(compared to the Pd-Cu wire)
- Superior small ball roundness, because the FAB is a hyperfine crystal.
- High strength and high elongation achieved by ultrafine crystal wires
- Resistant to wire flow and neck damage and formable into long and short loops
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